Referenced Items are not available for this document.
We show that a simple post-stress test can provide a good early reliability indicator. The defect types that have been revealed by this post-stress test are two types of conductive particles on metal levels. This early indicator has been of great value when dealing with potentially contaminated wafers/lots and to evaluate and to prioritize the corrective actions to solve the line issues
Published in:
Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
Date of Conference: 2001
- Page(s):
- 201 - 205
- Meeting Date :
- 23 Apr 2001-24 Apr 2001
- ISSN :
- 1078-8743
- Print ISBN:
- 0-7803-6555-0
- INSPEC Accession Number:
- 7023869
- Conference Location :
- Munich
- Digital Object Identifier :
- 10.1109/ASMC.2001.925647
- Product Type:
- Conference Publications
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