Referenced Items are not available for this document.
The present research investigates material transfer associated with the contact between polymers and silicon surfaces. Material transfer from a variety of solid polymers (UHMWPE, Teflon, KEL-F, PMMA, Nylon 66, and PEEK) was studied and characterized by optical microscopy, scanning electron microscopy, atomic force microscopy, and by computer image analysis. Experimental results suggest that material transfer is affected by the Hertz contact area. The number of particles and the total particle area increase with an increase in load and a decrease in the Young's modulus. Also, material transfer increases when the contacting surfaces are rougher. Friction appears to be a weak parameter in the material transfer phenomenon. Additionally, hardness is significant only when normal loading is great enough to initiate plastic deformation in the polymer
Published in:
Semiconductor Manufacturing, IEEE Transactions on
(Volume:14
,
Issue:
2
)
Date of Publication: May 2001
- Page(s):
- 85 - 96
- ISSN :
- 0894-6507
- INSPEC Accession Number:
- 6928833
- Digital Object Identifier :
- 10.1109/66.920718
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 07 August 2002
- Issue Date :
- May 2001
- Sponsored by :
- IEEE Components, Packaging and Manufacturing Technology Society
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