By Topic

Study of curing mechanism of epoxy/phenolic system for underfill applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Zhuqing Zhang ; Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; C. P. Wong

Underfill technology has been adopted for high reliability in flip-chip on organic board. The epoxy/phenolic resin system is a potential candidate underfill. The curing mechanism of the epoxy/phenolic system is studied using the differential scanning calorimeter and temperature controlled Fourier transform infrared spectrometer. The effect of hardener and catalyst type and the catalyst concentration on the curing mechanism is investigated. It is found that 1,8-diazabicyclo[5.4.0]undec-7-ene has the tendency to catalyze condensation reaction within hydroxyl groups at high temperature during curing. It can be a potential concern in no-flow underfill applications when the resin undergoes high temperature reflow

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: