Referenced Items are not available for this document.
This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (~1 μm) of the printed elements, the large area coverage (~1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics
Published in:
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Date of Conference: 2001
- Page(s):
- 98 - 103
- Meeting Date :
- 11 Mar 2001-14 Mar 2001
- Print ISBN:
- 0-930815-64-5
- INSPEC Accession Number:
- 6939888
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAOM.2001.916556
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
