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Rubber stamped plastic circuits for electronic paper

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7 Author(s)
Rogers, J.A. ; AT&T Bell Labs., Murray Hill, NJ, USA ; Baldwin, Kirk ; Bao, Zhenan ; Dodabalapur, Ananth
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This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (~1 μm) of the printed elements, the large area coverage (~1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics

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Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

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