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Spherical silicon 1 mm device and its clustering

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1 Author(s)
N. Takeda ; Ball Semicond. Inc., Allen, TX, USA

Instead of using conventional flat and rectangular chip technology, the paper proposes fabrication of semiconductor devices and sensors on 1 mm-diameter spherical silicon (Ball) substrates. This paper describes five key enabling process technologies to realize Ball products such as integrated circuits and 3-axis accelerometers, including a clustering technology to connect Ball devices together like the atoms of a molecule

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Date of Conference: