Referenced Items are not available for this document.
High thermal conductivity underfill has been developed. The underfill is filled with fine particle size aluminum nitride that provides the high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for underfill, such as the Level 3 JEDEC preconditioning test. This paper presents work in developing an approach to underfill material for flip-chip packaging using aluminum nitride
Published in:
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Date of Conference: 2001
- Page(s):
- 46 - 50
- Meeting Date :
- 11 Mar 2001-14 Mar 2001
- Print ISBN:
- 0-930815-64-5
- INSPEC Accession Number:
- 6939879
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAOM.2001.916547
- Product Type:
- Conference Publications
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