An electrohydrodynamic polarization micropump for electronic cooling

This paper presents the design, fabrication, and characterization of an innovative microcooling device for microelectronics applications. The device incorporates an active evaporative cooling surface, a polarization micropump, and temperature sensors into a single chip. The micropump provides the required pumping action to bring the working fluid to the evaporating surface, allowing the effective heat transfer coefficient through a thin-film evaporation/boiling process. The device is based on VLSI microfabrication technology, allowing the electrohydrodynamic (EHD) electrodes to be integrated directly onto the cooling surface. Since the EHD electrodes are fabricated using the same technology as the electronic systems themselves, the proposed microelectronic cooling system in the form of an integrated microchip is very suitable for mass production. The prototype devices demonstrated a maximum cooling capacity of 65 W/cm/sup 2/ with a corresponding pumping head of 250 Pa. The results of this investigation will assist in the development of future microcooling devices capable of operating at high power levels.