By Topic

A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
C. -L. Shih ; Dept. of Mater. Sci. & Eng., Case Western Reserve Univ., Cleveland, OH, USA ; B. -K. Lai ; H. Kahn ; S. M. Phillips
more authors

Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described

Published in:

Journal of Microelectromechanical Systems  (Volume:10 ,  Issue: 1 )