Using overall equipment effectiveness (OEE) and the equipment improvement process (ET) to improve Fab throughput

Total Productive Manufacturing has been used for many years as a tool to help Semiconductor companies improve Equipment reliability, involve the Workforce In Equipment care, improve the Maintenance function, and improve overall Fab cleanliness and Safety. Almost all chipmakers have one form or another of TPM in place. However, as with many improvement processes, many of the TPM promises have yet to be met. Even in mature TPM implementations, some serious questions need to be asked.