By Topic

Scylla: a smart virtual machine for mobile embedded systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
P. Stanley-Marbell ; Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA ; L. Iftode

With the proliferation of wireless devices with embedded processors, there is an increasing desire to deploy applications that run transparently over the varied architectures of these devices. Virtual machines are one solution for code mobility, providing a virtualized processor architecture that is implemented over the individual node architectures. Proposed virtual machines for embedded systems are generally slow and consume significant energy, making them unsuitable for devices with limited processing power and energy resources. Presented is a novel virtual machine architecture, Scylla, specially designed for mobile embedded systems, that is simple, fast and robust. In addition to a basic instruction set, Scylla supports inter-device communication, power management and error recovery. To make on-the-fly compilation extremely efficient, the instruction set closely matches popular processor architectures that can be found in embedded systems today. This paper describes Scylla, along with a preliminary evaluation of its performance, including the costs of the on-the-fly compilation and the overhead of having a virtual machine, based on simulations and measurements on a prototype system

Published in:

Mobile Computing Systems and Applications, 2000 Third IEEE Workshop on.

Date of Conference: