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Monolithically processed vertically interconnected 3D phased array antenna module

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1 Author(s)
A. M. Ferendeci ; ECECS Dept., Cincinnati Univ., OH, USA

A novel vertically interconnected 3D monolithically integrated antenna module development for conformal phased array antenna applications is presented. The module is processed layer by layer. Each subsequent layer is connected to the adjacent layers by vertical posts. In the initial developmental design, the module is comprised of a power amplifier, a phase shifter and a planar antenna on the final upper layer. The power amplifier uses a chip transistor embedded in a substrate with matching and bias networks that are processed in the ensuing upper layers. The uniqueness of the phase shifter is that it uses RF MEMS switches that are embedded in multilayers over the amplifier. The final two layers constitute a wide bandwidth balun and a slotted spiral antenna. A circuit plane is sandwiched between two polyimide dielectric layers which are also sandwiched between two ground planes. A sub-circuit of a given layer is initially simulated separately using commercially available CAD software followed by circuit processing and characterization

Published in:

National Aerospace and Electronics Conference, 2000. NAECON 2000. Proceedings of the IEEE 2000

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