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Hardware for production test of RFID interface embedded into chips for smart cards and labels used in contactless applications

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1 Author(s)
da Costa, C. ; Teradyne Inc., USA

Application-oriented, production wafer test of the RFID interfaces embedded in VLSI devices such as contactless applications for smart cards and identification TAGs, falling in the frequency range below 20 MHz, require a specific testing solution. There must be external circuitry on the probe card with limits of the parallel test to 1 to 3 devices. A test solution embedded into standard ATE and capable of testing up to 32 dies in parallel, without any external circuits will be discussed in this paper

Published in:

Test Conference, 2000. Proceedings. International

Date of Conference:

2000

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