Referenced Items are not available for this document.
In this paper we propose a new technology to obtain SOI (silicon-on-insulator) substrates. This new technology is based on silicon direct bonding techniques using hydrophilic surfaces. The obtained substrates can be used in MOEMS for ingression of light sources. This method is high versatile and provides a high degree flexibility in materials integration
Published in:
Semiconductor Conference, 2000. CAS 2000 Proceedings. International
(Volume:2
)
Date of Conference: 2000
- Page(s):
- 531 - 534 vol.2
- Meeting Date :
- 10 Oct 2000-14 Oct 2000
- Print ISBN:
- 0-7803-5885-6
- INSPEC Accession Number:
- 6839346
- Conference Location :
- Sinaia
- Digital Object Identifier :
- 10.1109/SMICND.2000.889149
- Product Type:
- Conference Publications
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