By Topic

The implication of the next-generation wireless network design: cellular mobile IPv6

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Han-Chieh Chao ; Dept. of Electr. Eng., Nat. Dong Hwa Univ., Taiwan ; Yen-Ming Chu ; Mu-Tai Lin

The initiatives to add mobility to the Internet and packet data services for next-generation cellular systems are being considered by many mobile service providers. IPv6 is a new version of the Internet protocol that was standardized by the Internet Engineering Task Force (IETF). It supports mobility and is presently being standardized by the IETF Mobile IP Working Group. At the same time, cellular is an inevitable and developing architecture for the Personal Communication Service system (PCS). In this paper, cellular mobile IPv6 (CMI), a new algorithm that is migrated from mobile IPv6 is proposed for mobile nodes moving among small wireless cells at high speed. It is important for future mobile communication environments and should eventually, integrate its functions with the Internet. The purpose of this paper is to solve the problems of a communication break within smaller cellular coverage during high-speed movement with packet-switched data or the real-time voice messages. Thus, voice over IP (VoIP) packets were chosen to implement the system. Simulation results show smooth and non-breaking handoff during high-speed movement using the proposed algorithm

Published in:

IEEE Transactions on Consumer Electronics  (Volume:46 ,  Issue: 3 )