Referenced Items are not available for this document.
IC packaging continues to grow in complexity. The trend to smaller packaging with higher pin counts requires PWB (printed wiring board) technology to keep pace. The current answer to this continuing trend of component micro sizing is the emerging Microvia Technology. At IBIDEN we have dedicated our resources to the study of the technology and process capability of Microvia PWBs. We have achieved this goal by analyzing photo and laser via forming, subtractive and additive patterning and various combinations of base materials that exhibit specific physical characteristics
Published in:
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Date of Conference: 2000
- Page(s):
- 233 - 237
- Meeting Date :
- 06 Mar 2000-08 Mar 2000
- Print ISBN:
- 0-930815-59-9
- INSPEC Accession Number:
- 6770667
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAPM.2000.869277
- Product Type:
- Conference Publications
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