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Thru-silicon vias for 3D WLP

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3 Author(s)
Savastionk, S. ; Tro-Si Technol. Inc., Sunnyvale, CA, USA ; Siniaguine, O. ; Korczynski, E.

Thru-Silicon designs and manufacturing process flows are introduced as a means to produce 3D wafer level packaging solutions. Standard silicon IC manufacturing unit-processes must be combined into robust process-flows to allow for the rapid deployment of wafer-level packaging throughout the industry

Published in:

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Date of Conference: