Referenced Items are not available for this document.
Thru-Silicon designs and manufacturing process flows are introduced as a means to produce 3D wafer level packaging solutions. Standard silicon IC manufacturing unit-processes must be combined into robust process-flows to allow for the rapid deployment of wafer-level packaging throughout the industry
Published in:
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Date of Conference: 2000
- Page(s):
- 206 - 207
- Meeting Date :
- 06 Mar 2000-08 Mar 2000
- Print ISBN:
- 0-930815-59-9
- INSPEC Accession Number:
- 6770661
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAPM.2000.869271
- Product Type:
- Conference Publications
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