Cart (Loading....) | Create Account
Close category search window
 

Adhesion characterization of no flow underfill baselined with fast flow snap cure

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Jicun Lu ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Smith, B. ; Baldwin, D.F.

Adhesion of underfill is critical to the reliability of a flip chip assembly. This paper focuses on characterization of underfill adhesion between underfill and Si3N4 passivated chip based on shear testing. A new die shear test vehicle is developed. The adhesion of a no flow underfill before and after post baking is investigated. It was found that post baking enhances the adhesion of the no flow underfill studied significantly. After post baking, the no flow underfill has similar adhesion to the passivated chip compared to a fast flow snap cure underfill used as baselines. In addition, the failure mode in the shear tests shifts from combined adhesive and cohesive failure in non-post-baked samples with no flow underfill, to underfill/substrate interface fracture in post baked samples

Published in:

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Date of Conference:

2000

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.