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The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]

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3 Author(s)
Boning, D.S. ; Microsyst. Technol. Lab., MIT, Cambridge, MA, USA ; Heytens, M.L. ; Wong, A.S.

A formal object-oriented approach to the data structuring and data management of semiconductor wafer structure and device information is presented. The profile interchange format (PIF) is extended beyond a file format `intersite' version in order to enhance the storage and access of profile information, the communication of profile information between cooperating tools, and the integration and portability of technology CAD (computer-aided design) tools. An intertool PIF toolkit is a programmatic interface to profile information, consisting of a library of objects for the storage and manipulation of data by technology CAD tools. PIF/Gestalt is presented as a test implementation of the toolkit which provides C and Common Lisp language interfaces, implemented on a database for use in a CAD/CIM (computer integrated manufacturing) system for semiconductor process design and fabrication

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:10 ,  Issue: 9 )

Date of Publication:

Sep 1991

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