By Topic

A study of the high frequency performance of thin film capacitors for electronic packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Chen, K.Y. ; Texas Instrum. Inc., Dallas, TX, USA ; Brown, W.D. ; Schaper, L.W. ; Ang, S.S.
more authors

The provision of adequate decoupling capacitance in the power distribution system for integrated circuits (ICs) is an increasing concern. As clock rates and the IC gate density increase, discrete chip capacitors do not satisfy the decoupling requirements for high current switching at very high frequencies. Thin film capacitors not only exhibit better high frequency performance than discrete ceramic capacitors, but also provide the possibility for passive component integration. In this work, the high frequency performance of thin film capacitors was investigated using Maxwell Eminence, a high frequency structure simulator based on the finite element method. Good agreement between the calculated impedance and experimental results was obtained. At high frequencies, the performance of thin film capacitors is related to contact configurations, dielectric and metal layer thicknesses, and capacitor shapes. The influence of these factors on the impedance behavior was examined. Equivalent circuits of a thin film capacitor for use in a circuit simulator at high frequencies are discussed

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )