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Development of three-dimensional memory die stack packages using polymer insulated sidewall technique

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6 Author(s)
Hyoung Soo Ko ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea ; Kim, Jin S. ; Hyun Gook Yoon ; Se Young Jang
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A newly designed three dimensional (3-D) memory die stack package has been established, and the prototype of the 3-D package using mechanical dies has been successfully demonstrated. Fabrication processes of the 3-D package consist of: (1) wafer cutting into die segments; (2) die passivation including sidewall insulation; (3) via opening on the original I/O pads; (4) I/O redistribution from center pads to sidewall; (5) bare die stacking using polymer adhesive; (6) sidewall interconnection; and (7) solder balls attachment. There are several significant improvements in this new 3-D package design compared with the current 3-D package concept. The unique feature of this newly developed package is the sidewall insulation of dies prior to the I/O redistribution of dies, which produces (1) better chip-to-wafer yields and (2) significant process simplification during subsequent fabrication steps. According to this design, 100% of die yields on a conventional wafer design can be obtained without any neighboring die losses which usually occur during the I/O redistribution processes of conventional 3-D package design. Furthermore, the new 3-D package design can simplify the following processes such as I/O redistribution, sidewall insulation, sidewall interconnection, and package formation. It is proven that the mechanical integrity of the prototype 3-D stacked package meets requirements of the JEDEC Level III and 85°C/85% test

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )

Date of Publication:

May 2000

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