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High boron doped etch stop technique used in micromachining of silicon membranes and cantilevers [and optomechanical microsensor application]

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3 Author(s)
R. Muller ; Nat. Inst. for Res. & Dev. in Microtechnol., Bucharest, Romania ; E. Manea ; I. Pavelescu

This paper describes the manufacture of three dimensional microstructures, using p+ etch stop techniques. Our experiments focused on bulk and front side micromachining and the integration of these structures with optical waveguides for microsensors with optical read-out applications. By annealing treatment we reduce the tensile stress induced in the cantilever beams

Published in:

Semiconductor Conference, 1999. CAS '99 Proceedings. 1999 International  (Volume:2 )

Date of Conference:

Oct 1999