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Two methods for improved accuracy calibration and control of ion implanter incidence angle

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4 Author(s)
R. D. Elzer ; Motorola Inc., Chandler, AZ, USA ; P. Oakey ; J. Chen ; D. Sing

Recent trends in semiconductor manufacturing require the use of higher energy ion implantation and tighter implant angle control. This paper describes the use of SIMS profiles and ThermaWave ThermaProbe maps to determine the accuracy of ion implanter tilt and twist orientation

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Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI

Date of Conference: