Cart (Loading....) | Create Account
Close category search window
 

Applications of automatic defect classification in photolithography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Stinson, G. ; Microchip Technol. Inc., Tempe, AZ, USA ; Magluyan, B.

This paper presents two applications of Automatic Defect Classification (ADC) to monitor and control defect density in photolithography processing. These techniques can also apply to any process module. Many defect types are only generated when the wafer pattern is present while other yield impacting defects are detected only on monitor wafers due to a low signal-to-noise ratio on product wafers. The use of ADC in both cases to find root cause solutions is a powerful tool enabling a quick time to obtain results and reduced yield risk in the manufacture of integrated circuits

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI

Date of Conference:

1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.