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Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination

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1 Author(s)
Novak, I. ; Sun Microsyst. Inc., Burlington, MA, USA

Power and ground planes are required to have low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances, which increase the impedance and also the radiation from the edge of the board. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, as well as measured impedance plots are presented for power-ground planes

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Advanced Packaging, IEEE Transactions on  (Volume:22 ,  Issue: 3 )