By Topic

Measuring and modeling package interconnects using vector network analyzers and time domain transforms

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Dunsmore, J. ; Hewlett-Packard Co., Santa Rosa, CA, USA

The design of electronic packaging interconnects requires precise knowledge of the RF performance in an end use environment. Separating the effects of test fixtures and measurement error from the actual interconnect performance has been a difficult prospect. Vector network analyzers have the capability of measuring the reflection coefficient, or return loss, of a device, then applying an inverse Fourier transform to obtain a time domain response of the device. This response, similar to a time domain reflectometer trace, can be manipulated to remove the unwanted responses of fixtures and transitions, generating a true picture of the desired interconnect frequency response. While this technique has been demonstrated using microwave network analyzers, it can be applied to lower cost RF network analyzers if care is used on designing and calibrating test fixtures.

Published in:

ARFTG Conference Digest, 1998. Computer-Aided Design and Test for High-Speed Electronics. 52nd

Date of Conference:

3-4 Dec. 1998