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Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications

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3 Author(s)
Shi, S.H. ; Center of Packaging Res., Georgia Inst. of Technol., Atlanta, GA, USA ; Yamashita, T. ; Wong, C.P.

This paper aims to provide underfill manufacturers and electronic packaging companies with general information about imidazole derivative cured bisphenol A epoxy materials. Four selected imidazole derivatives and one bisphenol A epoxy resin were investigated in this paper. Differential scanning calorimetry (DSC) was used to study the curing kinetics of the prepared formulations and glass transition temperature (Tg) of the cured formulation. A thermo-mechanical analyzer (TMA) was used to investigate the heat flex temperature and coefficient of thermal expansion (CTE). A dynamic-mechanical analyzer (DMA) was used to measure the storage modulus (E') and cross-linking density (ρ) over a temperature range from 25°C to 250°C of the cured materials. A rheometer was used to investigate the viscosity (η) of these formulations. The effects of the curing agent type and concentration on the curing kinetics, Tg, CTE, E', ρ, and η were then investigated. The correlation between CTE (above Tg ) and cross-linking density was examined and discussed

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999