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Aluminum nitride packaging

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4 Author(s)
M. Ishida ; R&D Center, Kyocera Corp., Japan ; T. Hasegawa ; T. Iwaida ; A. Knudsen

Due to its high thermal conductivity (TC) and a low thermal expansion coefficient, which is comparable to that of Si, aluminum nitride (AlN) has been adopted for packages requiring high thermal dissipation. Kyocera has been conducting research and development on AlN for more than ten years, and has produced many kinds of AlN products, such as Cer-Quad and multilayer packages, in addition to thin film substrates. We have developed a novel low-temperature co-fireable AlN composition (AN75W) to reduce cost. In this paper, we describe the thermal properties of the AN75W material, with a brief description of the general characteristics of packages produced with this ceramic

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999