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Effect of oxidation on mold compound-copper leadframe adhesion

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3 Author(s)
Berriche, R. ; Harris Semicond., Melbourne, FL, USA ; Vahey, S.C. ; Gillett, B.A.

The effect of oxidation on adhesion between a mold compound and copper leadframe material was investigated for OCN and DCP molding compounds and one copper alloy. The oxidation temperatures selected were 175 and 200°C and the bake times were varied between 5 minutes and 118 hours. Adhesion strength results obtained by the button shear test method indicated that the DCP mold compound-Cu adhesion was virtually unaffected by oxidation of the Cu at both 175 and 200°C for exposure times up to 50 minutes. The adhesion in the case of the OCN mold compound was lower and exhibited a sharp decrease with increasing bake time at both temperatures. The degradation in adhesion strength was attributed primarily to the low cohesive strength of the copper oxide layer

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999