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Multi-layered structure: adhesive selection and process mechanics [HDI]

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6 Author(s)
S. Manjula ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; V. Sundararaman ; S. K. Sitaraman ; C. P. Wong
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The fabrication of high-density interconnect structures typically involves sequential processing of alternate layers of thin organic dielectric materials and conducting copper lines. With the continued push toward low-cost fabrication, large-area processing of thin-film materials is being aggressively pursued by the electronic packaging industry. The objective of the ongoing work at Georgia Tech in collaboration with the MCM-D consortium is to develop innovative materials, models, and processing techniques to facilitate large-area processing of alumina and silicon tiles. As the alumina and silicon tiles are commercially available in smaller dimensions, a palletization approach has been developed to facilitate large-area processing. In the palletization approach, alumina and silicon tiles are attached to re-usable glass pallets with an in-house developed thermally-stable, reworkable, and highly-compliant adhesive

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999