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Assembly and disassembly of bare chips using on-substrate linear micro vibromotor arrays

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3 Author(s)
Saitou, K. ; Dept. of Mech. Eng. & Appl. Mech., Michigan Univ., Ann Arbor, MI, USA ; Wou, S.J. ; Dung-An Wang

A new method for the on-substrate fine positioning of micro/meso-scale discrete components is proposed, where component positions are finely adjusted using micro linear sliders and fixtures on the substrate. Each micro linear slider is actuated by vibratory impacts exerted by two pairs of micro cantilever impacters. These micro cantilever impacters are selectively resonated by shaking the entire substrate with a piezoelectric vibrator realizing forward and backward slider motion to facilitate assembly and disassembly of a micro component on the substrate. An array of the prototype externally-resonated linear micro vibrometers is fabricated using the MCNC MUMPS service. These prototypes are tested for forward and backward motion via external vibration applied by a piezoelectric stack vibrator. The linear micro vibromotor array is to be integrated in a on-chip micro assembly device where the assembly of micro/meso-scale discrete components (bare chips) on a common substrate is done by the combination of vibratory palletization for gross positioning, and linear micro vibromotor for fine positioning

Published in:

Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On

Date of Conference:

1-3 Feb 1999