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Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system

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8 Author(s)
Habu, K. ; Center for Environ. Technol., Sony Corp., Yokohama, Japan ; Takeda, N. ; Watanabe, H. ; Ooki, K.
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Environmental concerns have led the authors to develop a lead-free solder. Their observation that a small amount of Ge drastically improves solderability and reliability of SnAg alloys resulted in the development of a novel lead-free solder alloys with a composition of Sn-20Ag-4.0Bi-0.5Cu-0.1Ge. They also confirmed that the developed solder was usable in conventional soldering machines without changing operational conditions

Published in:

Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On

Date of Conference:

1-3 Feb 1999

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