Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

True constant temperature measurement system for lifetime tests of metallic interconnections of IC's

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ciofi, C. ; Dipt. di Ingegneria dell''Inf., Elettronica, Inf. Telecomunicazioni, Pisa Univ., Italy ; Giannetti, R. ; Neri, B.

The design and principle of operation of a measurement system for performing reliability tests on integrated circuit metallic interconnections is presented. The instrument is controlled by a personal computer which sets the test conditions (current and temperature) and acquires the data during the entire duration of the lifetime test. Unlike traditional systems designed for this application, an independently controlled microoven is provided for each sample under test. This solution compensates for the effect of the Joule heating of the samples which is not constant during the test and slightly different from one sample to another. This approach will allow, probably for the first time, such tests to be performed under ideal conditions of constant current and temperature for all the samples

Published in:

Instrumentation and Measurement, IEEE Transactions on  (Volume:47 ,  Issue: 5 )