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Stability of hydrogenated short-channel (/spl les/3 /spl mu/m) p-channel poly-Si TFT's with very thin (12 nm) electron cyclotron resonance N/sub 2/O plasma gate oxide is investigated. The fabricated poly-Si TFT's with gate length not less than 2 /spl mu/m show excellent stability characteristics of less than 0.1 V in the threshold voltage shift and less than 3% in the percent change of transconductance after harsh electrical stresses. In a small |V/sub G/| stress, an effective shortening of channel length is observed due to trapping of hot-electrons and the minimum leakage current is decreased. However, a large |V/sub G/| stress causes more degradation on the subthreshold slope and minimum leakage current due to trapping of hot-holes.