Referenced Items are not available for this document.
Contact angle measurement, using advanced instrumentation, is assuming an increased role in monitoring those semiconductor manufacturing processes which modify the surface characteristics of wafers. Such measurements can provide rapid, nondestructive and spatially and time resolved data in an automated mode. This information can be related to processing uniformity and can in many cases provide information on the chemical state of the surface. Illustrations are provided in the wafer cleaning, lithography, and interconnect areas. New application areas illustrated include measurement of the uniformity of UV photostabilization processes, measurement of contrast curves, and determination of receding and advancing contact angles of processed copper wafers
Published in:
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Date of Conference: 23-25 Sep 1998
- Page(s):
- 272 - 277
- Meeting Date :
- 23 Sep 1998-25 Sep 1998
- ISSN :
- 1078-8743
- Print ISBN:
- 0-7803-4380-8
- INSPEC Accession Number:
- 6245043
- Conference Location :
- Boston, MA
- Digital Object Identifier :
- 10.1109/ASMC.1998.731571
- Product Type:
- Conference Publications
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