Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting technique

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
3 Author(s)
Kosaka, H. ; NEC Opto-Electron. Res. Labs., Ibaraki, Japan ; Kajita, M. ; Sugimoto, Yoshimasa

We have developed plastic-molded receptacle-lope vertical-cavity surface-emitting laser (VCSEL)-array modules directly push/pull connectable with the one-dimensional (1-D) conventional mechanically-transferable multifiber push-on (MPO) fiber connector and with a new two-dimensional (2-D) MPO-compatible fiber connector developed for this module. The VCSEL was mounted on the plastic-molded package using a highly precise completely alignment-free process using flip-chip solder bonding and ball-guide die bonding. These modules exhibit an optical coupling loss of 0.67±0.23 dB (efficiency: 85.8±2.93%) and a loss deviation of less than 0.26 dB for 100 matings with the fiber connector (MMF50). The modules were operated at a bit rate of 1 Gbps/ch without an isolator and showed floorless bit error rate (BER) performance at temperatures up to 70°C. At 1 Gbps/ch their optical sensitivity at a BER of 10-11 was -26.0 dBm±0.9 dB. These structures and techniques are applicable to high-density, high-throughput optical parallel interconnections and optical space-division switches

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 4 )