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A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeterwave assemblies. The following paper discusses design and fabrication of such interconnects. A quasistatic model is developed to ease the quality assessment of their electrical behavior. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibit low loss and is useable up to 50 GHz or more
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:21
,
Issue:
4
)
Date of Publication: Nov 1998
- Page(s):
- 463 - 470
- ISSN :
- 1070-9894
- INSPEC Accession Number:
- 6105036
- Digital Object Identifier :
- 10.1109/96.730429
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Nov 1998
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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