Referenced Items are not available for this document.
The fabrication and characterization of flip-chip assemblies using four polymeric conductive pastes as attachment materials are reported. Three thermoset and one thermoplastic polymeric conductive pastes were investigated. Polymeric conductive pastes having silver particles 2 μm in size made good contact to either smooth or rough metal. Electrical contact with pastes whose particles were 5 μm or larger could only be obtained on rough metal
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:21
,
Issue:
4
)
Date of Publication: Nov 1998
- Page(s):
- 382 - 393
- ISSN :
- 1070-9894
- INSPEC Accession Number:
- 6105026
- Digital Object Identifier :
- 10.1109/96.730419
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Nov 1998
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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