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The technology of hard glass layers on silicon substrates and their application in microwave semiconductor devices

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2 Author(s)
M. Grabowski ; Inst. of Electron. Technol., Warsaw, Poland ; W. Jablonski

Paper describes the method of preparing of hard glass layers on silicon substrates. The thickness of the wafers run from few to one hundred micrometers. Hard glass layers are applied for microwave semiconductor components as passivation layers or thick dielectric supports for beam-leads contacts to reduce parasitic capacitance

Published in:

Advanced Semiconductor Devices and Microsystems, 1998. ASDAM '98. Second International Conference on

Date of Conference:

5-7 Oct 1998