By Topic

A test board for multiport immittance measurement and characterization of RF-IC packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Tripathi, A. ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; Lutz, R. ; Tripathi, V.K.

An experimental technique based on the measurement of two port scattering parameters for the characterization of electrically small RF-IC package is presented. The procedure is based on a novel test board design to facilitate extraction of n-port admittance and impedance matrix parameters using two port network analyzer scattering parameter measurements. An optimization routine is used to extract the SPICE based equivalent circuit model that includes the mutual coupling effects present in the RF-IC package pins.

Published in:

Microwave Symposium Digest, 1998 IEEE MTT-S International  (Volume:3 )

Date of Conference:

7-12 June 1998