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This paper describes the design, manufacturing and measurement of 3D microwave modules. The vertical interconnection between stacked circuits is based on an shielded homogeneous coplanar line with a 90/spl deg/ vertical structure. The fabrication of these modules is in relation with the "MultiChip Module Vertical" technology, originally developed for digital applications. The electrical measurement in the Ku-band demonstrates very good results.
Microwave Symposium Digest, 1998 IEEE MTT-S International (Volume:3 )
Date of Conference: 7-12 June 1998