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A low-temperature IC-compatible process for fabricating surface-micromachined metallic microchannels

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4 Author(s)
I. Papautsky ; Dept. of Bioeng., Utah Univ., Salt Lake City, UT, USA ; J. Brazzle ; H. Swerdlow ; A. B. Frazier

In this paper, a low-temperature integrated-circuit (IC)-compatible process for fabricating metallic microchannels is described. Arrays of 1-100 metallic microchannels have been fabricated on silicon and glass substrates. The process can be extended to many planar substrate materials including polymers and ceramics. The microchannels are formed using microelectro-formed metals. The microchannels demonstrated in this paper use nickel as the structural material and gold as the surface coating on the inside walls of the microchannels. The inner dimensions of the individual microchannels fabricated to date range from 30 μm to 1.5 mm in width, 0.5 mm to several centimeters in length, and 5-100 μm in thickness. The wall thickness ranges from 5 to 50 μm. The microchannel fabrication technology enables the fabrication of surface microchannels with a relatively large cross-sectional area. The metallic microchannels can be fabricated to extend from the substrate edge. Interfacing schemes are given for attaching external pressure feeds

Published in:

Journal of Microelectromechanical Systems  (Volume:7 ,  Issue: 2 )