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Advanced microelectronic packaging using BeO ceramics

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1 Author(s)
Sepulveda, J.L. ; Brush Wellman Inc., Tucson, AZ, USA

Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of circuits to insure high performance operation and product reliability

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998