By Topic

Economic and technical viability of integral passives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Integral substrates (printed wiring boards with buried capacitors and/or resistors) can lower costs, improve component density, improve performance and reliability. Integral substrates are economically and technically viable for replacing a large portion of the ceramic chip capacitors used for decoupling and resistor chips and networks used for termination, pull-up and pull-down. However, passive integration is easier said than done. Integral substrates require new design and test systems, manufacturing processes and materials. Further investigation concludes that stable, low cost materials and processes, design and test systems are only half the equation. In order for this technology to reach its full market potential, time-to-market issues such as rapid prototyping and engineering changes must be solved

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998