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Heat transfer modules for cooling electronics packages

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3 Author(s)
Black, W.Z. ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Giezer, A. ; Hartley, J.G.

The Thermal Management Group of the Packaging Research Center at the Georgia Institute of Technology is developing radically new and highly efficient cooling technologies suitable for on-the-spot and on-demand use on individual chips, MCMs and electronic packages. Our research efforts focus on the development of thermal management hardware that will target these heat flux levels in a low-profile, compact, reliable and inexpensive package. The cooling technologies are based manipulation of miniature single-phase jets using impulse actuators. The group is also developing two-phase versions for high heat flux applications. The technology can be applied as an open system (e.g. as a clip-on device for existing chips) or as a self-contained, integrated heat transfer module. The scalability, connectivity, and stackability of such modules could potentially provide significant improvements over current air-cooled thermal management schemes

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998