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Overview of advanced composites for thermal management

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1 Author(s)
C. Zweben ; Lockheed Missiles & Space Co. Inc., King of Prussia, PA, USA

A variety of new, advanced composites are now available which provide great advantages over conventional materials for thermal control and electronic packaging. This brief paper provides an overview of advanced composites used in thermal management, including properties, applications and future trends. The focus is on materials that have thermal conductivities that are at least as high as those of aluminum alloys

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998