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Characterization and processing of low dielectric constant thick film substrates for electronic packaging applications

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7 Author(s)
Kellerman, D. ; Lincoln Lab., MIT, Lexington, MA, USA ; Retherford, L. ; Nabatian, D. ; Bokalo, P.
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The application of the new microsphere Low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5×8.5 inches square with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. Electrical, physical, and materials characterization of both silver and gold compatible multilayer Low K dielectric material is detailed. High frequency characterization of the material is also discussed, over a wideband frequency bandwidth between 1-12 GHz

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998

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