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Molded chip scale package for high pin count

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6 Author(s)
Baba, S. ; Dept. of IC Assembly Eng., Mitsubishi Electr. Corp., Hyogo, Japan ; Tomita, Y. ; Matsuo, M. ; Matsushima, R.
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A unique molded chip scale package (CSP) associated 1024 pin counts has been developed. This package has the “bare die soldering” feature, that means highest mount density and enhanced electrical characteristic, and the “robust package” feature, that means easy to handle, to test and to standardize such as known good die (KGD). The wiring conductor patterns made of copper realized enhanced electrical characteristic. The solder bumping process with screen printing technique, was applied with cost competitiveness. And the transfer molding process produced high reliable package

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 1 )