By Topic

Molded chip scale package for high pin count

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
S. Baba ; Dept. of IC Assembly Eng., Mitsubishi Electr. Corp., Hyogo, Japan ; Y. Tomita ; M. Matsuo ; H. Matsushima
more authors

A unique molded chip scale package (CSP) associated 1024 pin counts has been developed. This package has the “bare die soldering” feature, that means highest mount density and enhanced electrical characteristic, and the “robust package” feature, that means easy to handle, to test and to standardize such as known good die (KGD). The wiring conductor patterns made of copper realized enhanced electrical characteristic. The solder bumping process with screen printing technique, was applied with cost competitiveness. And the transfer molding process produced high reliable package

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:21 ,  Issue: 1 )