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Self-aligned packaging of an 8×8 InGaAsP-InP space switch

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7 Author(s)
Wenger, G. ; Siemens AG, Regensburg, Germany ; Schienle, M. ; Bellermann, J. ; Acklin, B.
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By using an efficient and alignment tolerant fiber-chip coupling technology we can realize semiconductor space switches with a new and highly promising modular architecture. We present a completely packaged 8×8 matrix switch based on InGaAsP-InP intended for routing applications around wavelength 1.55 μm. The matrix is composed of sixteen 1×8 InGaAsP-InP switches that are optically interconnected by a shuffle comprising 64 single-mode fibers (SMFs). All the fiber ports of the InGaAsP-InP chips are provided with monolithically integrated optical spot-size transformers (MOSTs) that allow simple yet highly efficient self-aligned multifiber coupling. The 8×8 matrix shows a fiber-matrix-fiber insertion losses of 20 dB and a crosstalk suppressions of 28 dB. An extension of the matrix architecture to a 64×64 switch seems straightforward

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Selected Topics in Quantum Electronics, IEEE Journal of  (Volume:3 ,  Issue: 6 )