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Study of delaminated plastic packages by high temperature Moire and finite element method

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4 Author(s)
Sheng Liu ; Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA ; Jiansen Zhu ; Daqing Zou ; J. Benson

In the current study, 1200 l/mm gratings are replicated at elevated temperatures onto the cross sections of two delaminated plastic packages: a thin quad flatpack plastic package (TQFPP) and a power small outline plastic package (PSOPP). The specimens are measured at room temperature for thermal deformation induced by cooling process. The finite element models are used to simulate the cooling process and the results are compared with the Moire interferometry results. The finite element models with different delaminations between die and die attach are used to simulate the fringe patterns obtained from Moire interferometry. It was found that the delamination size can be estimated by the combination of Moire technique and finite element method. The finite element model, once verified, can then be used in making cost effective decisions in plastic packaging design and processing

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:20 ,  Issue: 4 )