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Resonant pressure sensor with on-chip temperature and strain sensors for error correction

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7 Author(s)
Chia-Fang Chiang ; Stanford University, Stanford, CA, USA ; Andrew B. Graham ; Brian J. Lee ; Chae Hyuck Ahn
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Temperature and package stress induced errors pose a challenging obstacle for improving accuracy of strain-based resonant pressure sensors. This paper presents a multiple sensor solution where three resonators were built under a shared pressure sensor diaphragm. By manipulating the anchoring scheme and the location of the resonators, temperature and stress signals can be independently captured and used to compensate for the errors in the pressure signal. After compensation, the pressure sensor showed a 20× reduction in temperature dependency and a 2× reduction in stress dependency.

Published in:

Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on

Date of Conference:

20-24 Jan. 2013